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VSOP383..
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Vishay Semiconductors
PACKAGE DIMENSIONS in millimeters
2
Marking area
3338
YWW
PIN 1
indicator
1. Coplanarity (0.1 mm)
applie s to the expo s ed
pad a s well a s the
expo s ed terminal s .
2. Package dimen s ion doe s not
include mold fla s h, protru s ion s ,
Chamfered corner
PIN 1 indicator
Expo s ed pad
1.6 ± 0.15
(8x)
0.25 ± 0.05
burr s , or metal s mearing.
Pinning:
1. n.c.
2. V S
3. Out
4. n.c.
5. n.c.
6. G ND
7. IN
8. G ND
Propo s ed hole layout
from component s ide
(for reference only)
Technical drawing s
according to DIN
s pecification s
Not indicated tolerance s ± 0.1
Drawing-No.: 6.550-5314.01-4
I ss ue: 2; 07.11.11
ASSEMBLY INSTRUCTIONS
Reflow Soldering
0.5 typ. (6x)
10:1
0.35 (8x)
0.5 (6x)
? Set the furnace temperatures for pre-heating and heating
in accordance with the reflow temperature profile as
shown in the diagram. Exercise extreme care to keep the
maximum temperature below 260 °C. The temperature
shown in the profile means the temperature at the device
surface. Since there is a temperature difference between
the component and the circuit board, it should be verified
that the temperature of the device is accurately being
measured
? Handling after reflow should be done only after the work
surface has been cooled off
Manual Soldering
? Use a soldering iron of 25 W or less. Adjust the
temperature of the soldering iron below 300 °C
? Finish soldering within 3 s
? Handle products only after the temperature has cooled
off.
Rev. 1.4, 05-Feb-14
4
Document Number: 82443
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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